Ag-Cu-Ge-Sn新型中温焊膏的研制与应用  

The Preparation and Application of New Ag-Cu-Ge-Sn Middle Temperature Alloy Solder Paste

作　　者：叶建军[1] 涂传政[1] 谭澄宇[2] 岳译新[2] 郑学斌[2] 

机构地区：[1]南京电子器件研究所,江苏南京210016 [2]中南大学材料科学与工程学院,湖南长沙410083

出　　处：《新技术新工艺》2007年第5期42-44,共3页New Technology & New Process

基　　金：国家资助项目(MKPT-04-106)

摘　　要：新型焊料Ag-24Cu-25Ge-4Sn（％）的熔化温度：544-557℃，固-液相间隔为：13℃；采用氮气雾化的方法将该焊料制成粉体，利用扫描电镜对焊料粉体形貌进行了观察，并用X-ray衍射对焊料的相结构进行了分析。研究表明：所制备的焊料粉体呈球形，粒径约20μm；焊料主要由富Ag相、Ge相、中间相Ag6.7Sn和Cu5Ge2相组成。利用丙烯酸酯类化合物为载体将其调配成膏状焊料；焊膏铺展试验表明，该焊料流散性一般，钎焊后焊料表面色泽光亮，但边界有堆积现象；钎焊截面分析发现，在钎焊界面处存在明显的多层过渡层，这应与镍基板上的Ni和钎料中元素Cu的互相扩散有关系。The melting temperature of Ag-24Cu-25Ge-4Sn(wt/)alloy solder was 544~557 and its solid-liquid phase temperature distance was about 13 .The powder of Ag-Cu-Ge-Sn alloy was prepared by sprayer cooler method. The alloy powder was observed and analyzed with SEM and X-ray diffraction. The results show that the solder powder mainly is the spheric particles with grain size about 20μm The alloy powder constitution would be made up with rich Ag phase, Ge phase, Ag6.7Sn and Cu5Ge2 phase. The solder paste was the atomized solder powder with acrylate and other organic matter. The test found that the solder paste had glassy welded surface. But the spread ability of the solder paste was general and obvious margin phenomena would occur on welded position. The analysis to the cross-section of the brazing sheet show that many transition layers exist on welded interface, which would relate with the interdiffusion of copper from the solder and nickel from matrix during braze welding.

关 键 词：Ag-Cu-Ge-Sn合金 中温焊膏 润湿性 界面 

分 类 号：TG425.2[金属学及工艺—焊接]