PCB激光投影成像装置关键技术参数分析  

Key Technical Parameters Analysis for PCB's LPI Equipment

作　　者：林清华[1] 李文静[1] 周金运[1] 

机构地区：[1]广东工业大学物理与光电工程学院,广东广州510006

出　　处：《半导体光电》2007年第2期294-297,共4页Semiconductor Optoelectronics

基　　金：广州市科技计划项目(2006Z3-D0041)

摘　　要：对用于印制电路板(PCB)工业化生产的激光投影成像装置中的激光投影系统和激光照明系统的关键技术参数进行了分析,在对装置整体性能设计要求下,理论推导和分析了符合实际场景的关键技术参数,包括分辨率、焦深、物镜结构、激光光源、照明相干度、像素密度和曝光时间,得到了相关的具有一定参考价值的结论。Key technical parameters for the laser projection system and the laser illumination system in the laser projection imaging（LPI） equipment used for printed circuit board （PCB） are analyzed. According to the overall performance design requirements for this kind of equipment, some key technical parameters, such as resolution, depth of focus, lens composition, laser source, illumination coherence, pixel density and exposure time, are theoretically reckoned up and analyzed. From the above analysis, it correspondingly comes to the conclusions with certain reference value.

关 键 词：印制电路板 激光投影成像 扫描曝光 

分 类 号：TN305.7[电子电信—物理电子学]