甘油铜络合物溶液化学镀铜的研究  

STUDY OF ELECTROLESS COPPER PLATING FROM COPPER-GLYCERIN COMPLEX SOULTION

作　　者：王鸿显[1] 赵红坤[2] 

机构地区：[1]南通大学化学化工学院,南通226007 [2]扬州大学化学化工学院,扬州225002

出　　处：《腐蚀科学与防护技术》2007年第3期178-180,共3页Corrosion Science and Protection Technology

基　　金：江苏省教育厅科学研究计划项目(JHZD04-021)

摘　　要：采用单因素优选实验法研究了影响化学镀铜速率和甘油铜镀液稳定性的各因素,确定了适宜的甘油铜化学镀液配方和工艺条件.结果表明,优选出的的镀液稳定性相对较高、沉铜速度快、镀层外观较好.The factors affecting the deposition rate of copper and stability of electroless copper plating solution were investigated. The formulation of bath solution and processing parameters were established by the research. The results show that the proposed bath solution was highly stabile, by which cupper plating had high deposition rate with good appearence. Therefore, the copper-glycerin camplex solution shows a good prospect for copper plating.

关 键 词：甘油铜络合物 化学镀铜 沉铜速度 镀液稳定性 

分 类 号：TQ153.1[化学工程—电化学工业]