热声焊机在电子封装业中的应用  

The Application of Heat Ultrasonic Bonding in the Electronic Package Field

作　　者：乔海灵[1] 董永谦[1] 王贵平[1] 

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024

出　　处：《电子工业专用设备》2007年第6期35-39,共5页Equipment for Electronic Products Manufacturing

摘　　要：热声焊技术可实现金丝的高质量焊接。介绍了热声焊的原理、焊接材料、工艺、设备,热声焊机已应用于微波器件、组件的制造及其相关工艺的研究。Heat ultrasonic bonding technology is a reliable method for gold wires. This paper introduces the theory,bonding material, process, and the equipment of Heat ultrasonic bonding, which has applied to the manufacturing of microwave devices and research of process technology for microwave devices.

关 键 词：热声焊 楔焊 封装 设备 

分 类 号：TN349.1[电子电信—物理电子学]