集成电路用铜基引线框架材料的发展与展望  

Development and Expectation of Copper-based Lead Frame Material Used in Intergrated Circuit

作　　者：李银华[1] 刘平[1] 田保红[1] 贾淑果[1] 任凤章[1] 张毅[2] 

机构地区：[1]河南科技大学材料科学与工程学院,洛阳471003 [2]西安理工大学材料科学与工程学院,西安710048

出　　处：《材料导报》2007年第7期24-26,47,共4页Materials Reports

基　　金：国家863计划(2006AA03Z528);国家自然科学基金(50571035);河南省杰出青年基金(0521001200)

摘　　要：综述了集成电路对铜基引线框架材料的性能要求,指出好的导电导热和强度性能是引线框架材料最主要的性能要求;讨论了铜基引线框架材料的国内外研究现状,指出我国的引线框架材料无论是质量还是数量都与其他工业发达国家有很大的差距,并指出微合金化铜基材料具有成为高强高导引线框架材料的潜力。In this paper, the property requirements of copper-based lead frame material used in intergrate cir cuit are reviewed, and the uppermost requirement being electricity conductivity and strength is pointed out. The actuality of research of copper-based lead frame material at home and abroad is described. The gap of lead frame material between our country and other industry developed countries in quality and quantity is pointed out. And it＇s pointed out that the micro alloying copper-based material will be likely to become the development direction of high strength and high conductivity lead frame material.

关 键 词：集成电路 铜基引线框架 微合金化 强度 导电率 

分 类 号：U641.482[交通运输工程—船舶及航道工程]