齿科陶瓷磨抛后表面残余应力的测算与分析  

Effects of Finishing and Polishing on Surface Residual Stresses of Dental Ceramic

作　　者：赵鑫[1] 陈吉华[1] 李旬科[1] 王迎捷[1] 

机构地区：[1]第四军医大学口腔医学院修复科,陕西西安710032

出　　处：《口腔医学研究》2007年第3期279-281,共3页Journal of Oral Science Research

摘　　要：目的:采用显微压痕裂纹法对使用各种打磨、抛光工具处理的陶瓷表面应力状态进行测算。方法:制作相对无应力试件,在不同加载压力下形成压痕裂纹。按照不同的磨抛方法分组,第1组为抛光组,第2～5组为磨光组,第6组为上釉对照组,在电子显微镜下观察压痕并测量裂纹长度。结果:抛光组和上釉组表面残余应力分别为:2.10Mpa、1.55Mpa,磨光组表面残余应力分别为:-17.01Mpa、-7.54Mpa、-3.24Mpa、-3.78Mpa。结论:磨光可使齿科陶瓷表面处于拉应力状态,抛光和上釉可使其转变为压应力状态,有利于提高其机械性能。Objective： To measure and analyze the stress on the ceramic surface after different finishing and polishing procedures. Methods： Specimens without surface residual stress were made and submitted to different loads to get cracks. According to different finishing and polishing procedures, specimens were divided into 6 groups （ groupl was polished, group2 - 5 were grinded, and group6 was glazed ）. The cracks on the surface of specimens were observed and measured under SEM. Results： The surface residual stress of polished group and glazed group were 2.10Mpa and 1.55Mpa. The surface residual stress of finished groups were - 17.01Mpa, - 7.54Mpa, - 3.24Mpa and - 3.78Mpa, respectively. Conclusion： Grinding would bring tensile stress on the ceramic surface, while the glazing or polishing could make the ceramic at press state and improve its mechanical performance.

关 键 词：齿科陶瓷 表面残余应力 压痕裂纹法 

分 类 号：R783.1[医药卫生—口腔医学]