大功率LED散热封装技术研究  

Technical Research on Heat-Release Package of High-Power LEDs

作　　者：苏达[1] 王德苗[1] 

机构地区：[1]浙江大学信息与电子工程系,杭州310027

出　　处：《照明工程学报》2007年第2期69-71,55,共4页China Illuminating Engineering Journal

摘　　要：如何提高大功率LED的散热能力,是LED器件封装和器件应用设计要解决的核心问题。本文详细分析了国内外大功率LED散热封装技术的研究现状,总结了其发展趋势并提出减少内部热沉可能是今后的发展方向。How to improve application design of heat-release package reducing the internal the heat-sinking capability is one of the key technical problems for the package and device concerned with high-power LEDs. In this paper, the present technical research on of high-power LEDs is analyzed, and the trend is summarized. Besides, it suggests that heat sink may be one of the developments in the future.

关 键 词：大功率LED 散热 封装 

分 类 号：TM923.3[电气工程—电力电子与电力传动] TN312.8[电子电信—物理电子学]