一种通用低成本大功率高亮度LED封装技术  

Packaging Technology for Low-Cost and High-Power/High-Brightness LED's

作　　者：唐政维[1] 关鸣[2] 李秋俊[1] 董会宁[1] 蔡雪梅[1] 

机构地区：[1]重庆邮电大学光纤通信技术重点实验室 [2]重庆邮电大学光电学院,重庆400065

出　　处：《微电子学》2007年第3期354-357,363,共5页Microelectronics

基　　金：重庆市科技攻关项目(CSTC2005AB4016)

摘　　要：提出了一种热传导高、热膨胀匹配良好、低成本、大功率、高亮度LED封装技术。该技术采用光电子与微电子技术相结合,利用背面出光的LED芯片,倒装焊接在有双向浪涌和静电保护电路的硅基板上。由于在封装中引入了热膨胀过渡层,在保证良好热膨胀匹配的同时,热阻增加少。采用该封装技术封装的白光LED,发光稳定,光衰小,长期寿命高。A packaging technology for low cost, high-power and high-brightness LED＇s with high heat-conductance and well-matched thermal expansion is proposed, in which LED chips reflecting light from back side are soldered onto a silicon substrate with bidirectional surge and static protection circuit by combining photoelectronics with microelectronics technology. A thermal expansion filtering transition layer is introduced in the package, which reduces the heat resistance while ensuring good match of thermal expansion. White-light LED＇s packaged in this technology have stable luminescence, small attenuation and extended lifetime.

关 键 词：大功率LED 白光LED LED封装 热膨胀匹配 热阻 

分 类 号：TN302[电子电信—物理电子学] TN305.94