无氰置换镀金工艺的研究  

Study of Non-Cyanide Immersion Gold Plating

作　　者：刘海萍[1] 李宁[1] 毕四富[1] 孔令涛[2] 谭谦[1] 

机构地区：[1]哈尔滨工业大学应用化学系,黑龙江哈尔滨150001 [2]哈尔滨工业大学(威海)海洋学院化学工程与工艺,山东威海264209

出　　处：《电镀与环保》2007年第4期26-28,共3页Electroplating & Pollution Control

摘　　要：探讨了工艺参数对无氰置换镀金液稳定性及镀层性能的影响;采用正交试验优化工艺,得到了镀液稳定性好、镀层性能良好的中性无氰置换镀金工艺。此工艺含有能够减缓镀金初始时沉积速率,又能降低对镍层腐蚀的添加剂。The effects of technological parameters of non-cyanide immersion gold plating on bath stability and deposit properties are investigated, A stable near-neutral, non-cyanide immersion gold plating process with good gold deposit is determined by orthogonal test method. The optimized immersion gold plating bath contains an organic additive which can slow down initiatory deposition rate, result in a slow dissolution of Ni-P substrate.

关 键 词：无氰 置换镀金 亚硫酸钠 印刷线路板 

分 类 号：TQ153[化学工程—电化学工业]