Sn-9Zn钎料与内加Cu质点和Cu基体界面生长行为  

Interfacial growth behavior of Sn-9Zn/additive Cu-particles and Sn-9Zn/Cu-substrate

作　　者：卫国强[1] 况敏[2] 杨永强[1] 赵利[2] 

机构地区：[1]华南理工大学机械工程学院,广州510641 [2]广州有色金属研究院材料表面中心,广州510651

出　　处：《中国有色金属学报》2007年第7期1083-1089,共7页The Chinese Journal of Nonferrous Metals

摘　　要：在Sn-9Zn无铅钎料中加入Cu金属质点,研究在长时间钎焊条件下钎料/Cu质点、钎料/Cu基体界面金属间化合物(IMCs)的生长行为。结果表明:在钎料/Cu质点和钎料/Cu基体界面处都生成Cu-Zn相(IMCs),其组成为Cu5Zn8+CuZn或Cu5Zn8,而且钎料/质点界面处IMCs的生长速度明显快于钎料/基体处;同时发现,Cu质点的加入大大减小了钎料/Cu基体界面IMCs的厚度。由于Cu质点原位生成Cu-Zn IMCs,消耗了焊点中的Zn,因此Sn-9Zn/Cu接头的可靠性得以提高。The growth behavior of interfacial intermetallic compounds （IMCs） of Sn-9Zn/additive Cu-particles and Sn-9Zn additive Cu-substrate was investigated under the condition of extended soldering time. The results show that the Cu-Zn phases, which are composed of CusZn8 and CuZn or CusZn8, are formed at the interfaces of both Sn-9Zn/Cu-particles and Sn-9Zn/Cu-substrate, simultaneously the growth rate of IMCs of Sn-9Zn/Cu-particles is markedly higher than that of Sn-9Zn/Cu-substrate. It is also shown that the addition of Cu-particles in Sn-9Zn solder greatly reduces the thickness of 1MCs layer of Sn-9Zn/Cu-substrate. The reliability for Sn-9Zn/Cu joint is improved for the diminished Zn content in soldering joint due to the in-situ formation of IMCs of Sn-9Zn/Cu-particles.

关 键 词：SN-9ZN钎料 无铅钎料 Cu质点 金属间化合物 

分 类 号：TG454[金属学及工艺—焊接]