新型封装材料与大功率LED封装热管理  

Novel packaging materials and thermal management of high-power LED packaging

作　　者：田大垒[1] 关荣锋[1] 王杏[1] 

机构地区：[1]河南理工大学材料科学与工程学院,河南焦作454003

出　　处：《电子元件与材料》2007年第8期5-7,19,共4页Electronic Components And Materials

基　　金：河南省重点科技攻关资助项目(072102240027);河南理工大学博士基金资助项目(648602)

摘　　要：高效散热封装材料的合理选择和有效使用是提高大功率LED(发光二极管)封装可靠性的重要环节。在分析封装系统热阻对LED性能的影响及对传统散热封装材料性能进行比较的基础上,阐述了金属芯印刷电路板材料、金属基绝缘板材料、陶瓷基板材料、导热界面材料和金属基复合材料结构特点、导热性能及其封装应用实例。指出了封装材料的研究重点和亟待解决的问题。Reasonable selection and efficient employment of packaging materials with high thermal conductivity are important for improving the reliability of high-power LED packaging. Based on the influences of systemic thermal resistance on LED performances, and comparison of traditional packaging materials, structural characteristics and thermal conductivity were introduced, including metal core printed circuit board, insulated metal substrates, ceramic substrates, thermal interface materials and metal matrix composites, various packaging application practices were described. In addition, the research emphases and problems to be solved at present of packaging materials are pointed out.

关 键 词：半导体技术 大功率LED 综述 封装材料 热管理 

分 类 号：TN305.94[电子电信—物理电子学]