利用图像处理技术评价硅片表面清洗率  

Evaluation of efficiency for silicon wafer cleaning by image processing

作　　者：王续跃[1] 许卫星[1] 司马媛[1] 吴东江[1] 康仁科[1] 郭东明[1] 

机构地区：[1]大连理工大学精密与特种加工教育部重点实验室,辽宁大连116024

出　　处：《光学精密工程》2007年第8期1263-1268,共6页Optics and Precision Engineering

基　　金：国家自然科学基金资助项目(No.52090101);国家"863"高技术计划资助项目(No.2002AA421230)

摘　　要：介绍了一种基于Matlab图像处理工具箱技术的评价硅片表面污染颗粒激光清洗率的新方法。借助Matlab图像处理工具箱,对清洗前后硅片表面光学显微镜照片进行处理,编写硅片表面激光干法清洗率的评价程序,统计清洗前后硅片表面评价区域的污染颗粒个数,对清洗效果进行定量评价。研究结果证明,利用此方法统计的颗粒数准确度达97.6%,得到的激光清洗率准确度达99.2%。结果表明,借助图像处理技术评定清洗效果是一种高效、快速、准确的新方法。Based on Image Processing Toolbox of Matlab technique, a new evaluation method of cleaning efficiency is presented in dry laser cleaning particles of silicon wafer surface. Image Processing Toolbox of Matlab is used to recognize optical information of silicon wafer surface before and after laser cleaning and the evaluating programs are developed to count the number of pollution particles on the silicon wafer and to evaluate the cleaning efficiency. The results show that the statistical accuracy of the method is 97.6% ,and the laser cleaning accurate reaches 99.2%. The research achievement offers a effective,rapid and accurate new evaluation method.

关 键 词：激光清洗 硅片 清洗率 图像处理 

分 类 号：TG665[金属学及工艺—金属切削加工及机床] TP391.4[自动化与计算机技术—计算机应用技术]