电解涂硅机理及应用工艺  

Mechanism of Electrolytic Silicon Depositing and Its Application Process

作　　者：戴学诚[1] 郁祖湛[2] 

机构地区：[1]宝钢股份有限公司,上海200941 [2]复旦大学,上海200433

出　　处：《宝钢技术》2007年第4期40-44,共5页Baosteel Technology

摘　　要：在大量试验的基础上,推断出电解涂硅在钢板表面呈空间网状结构,明确了影响涂硅量的关键因素是硅酸根离子浓度,得出电解涂硅的机理为特性吸附的结论,并分析了涂硅量对后续加工的影响,结果显示电解涂硅对后续加工无影响。在此基础上确定了合理的带钢涂硅量和工艺参数,冷轧黏结发生率大幅下降,实际应用效果良好。On the basis of many experimentations, it has been included that the silicon depositing on steel strip in way of the space reticulate structure, and the concentration of SiO4^4- is the most important factor influencing the quantity of the silicon depositing on steel strip. Through the experimentations, it has been proved that the mechanism of silicon depositing is characteristic adsorption. Through analyzing the effect of silicon depositing quantity on steel strip＇ s follow-up processing, the result indicates that the electrolytic silicon depositing has no effect on the follow-up processing. On the basis of this, reasonable silicon quantity and correct process parameters have been decided. The bonding frequency in cold rolling has been reduced greatly and a good result has been obtained.

关 键 词：电解 清洗 涂硅 黏结 

分 类 号：TG174.45[金属学及工艺—金属表面处理]