大功率LED封装散热技术研究  

Technical Research on Heat-Release Package of High-Power LEDs

作　　者：苏达[1] 王德苗[1] 

机构地区：[1]浙江大学信息与电子工程系,杭州310027

出　　处：《半导体技术》2007年第9期742-744,749,共4页Semiconductor Technology

摘　　要：LED被称为第四代照明光源或者绿色光源,广泛地应用于手机闪光灯、大中尺寸显示器光源模块以及特殊用途照明系统,并将被扩展至一般照明系统设备。由于LED结温的高低直接影响到LED的出光效率、器件寿命、发光波长和可靠性等,因此如何提高散热能力是大功率LED实现产业化亟待解决的关键技术之一。介绍并分析了国内外大功率LED散热封装技术的研究现状,总结了其发展趋势并提出减少内部热沉的热阻可能是今后的发展方向。LED is called the fourth generation light or green light, and it is widely used in mobile flashlight, large and medium size displays, illumination system in special usage, and also other future developments in illumination devices. The junction temperature of LED has directly iniluence upon light output efficiency, device life time, emitting wavelength and reliability of LED, so how to improve the heatsinking capability is one of the key technical problems for the industrialization of high-power LEDs. The present technical research on heat-release package of high-power LEDs is analyzed, and the trend is summarized. Besides, it suggests that reducing the internal heat sink may be one of the developments in the future.

关 键 词：大功率LED 散热 封装 

分 类 号：TN312[电子电信—物理电子学] TN305.94