HDI-LineCard制造技术与应用初探  

Fabrication and application of HDI-LineCard

作　　者：由镭 杨智勤 孔令文 

机构地区：[1]深圳市深南电路有限公司,广东深圳210018

出　　处：《印制电路信息》2007年第9期51-54,共4页Printed Circuit Information

摘　　要：文章以设计、制造、组装的顺序对HDI-LineCard产品现状进行叙述。重点从对准度、通孔/盲孔成型、通孔/盲孔的金属化以及可靠性方面讲述了HDI-LineCard产品制造的着力点,文末对未来HDI-LineCard的技术发展趋势进行了展望。The paper describes the actuality of HDI-Line Card products under the order of design, manufacture and assembly, and also describes the processing keys of HDI-Line Card by focusing on the registration￡-the molding and the PTH of through hole/microvia, as well as the reliability, give the future development of HDI-Line Card at the end of this paper.

关 键 词：HDI—LineCard 多层 微导通孔 

分 类 号：TN41[电子电信—微电子学与固体电子学]