无氰镀银技术发展及研究现状  

Development and Research Status Quo of Cyanide-free Silver Plating Technique

作　　者：张庆[1] 成旦红[2] 郭国才[3] 郭长春[1] 曹铁华[1] 

机构地区：[1]上海大学环境与化学工程学院,上海200072 [2]中国浦东干部学院,上海201204 [3]上海应用技术学院,上海200235

出　　处：《电镀与精饰》2007年第5期12-16,共5页Plating & Finishing

摘　　要：通过对硫代硫酸盐、丁二酰亚胺、碘化物、乙内酰脲、亚硫酸盐以及其它无氰镀银体系的分析,总结了当前无氰镀银工艺的技术特点及存在的问题,并阐述了无氰镀银技术的发展历程和研究现状。同时,基于国家目前的经济发展战略,对无氰镀银技术的前景予以了展望。Technical characteristics and existing problems of cyanide-free silver plating technology were summarized through the analysis of cyanide-free silver plating systems of thiosulfate, succinimide, iodide, hydantoin, sulfite and others. Development course and research status quo of the cyanide-free silver plating technique were elaborated. In the meantime, the development future of the cyanide-free silver plating technique is prospected based on current economy development strategy of our country.

关 键 词：无氰镀银 发展 研究现状 环境保护 

分 类 号：TQ153.1[化学工程—电化学工业]