微波介质陶瓷/铁氧体复合材料的低温共烧  

Low temperature co-firing properties of microwave dielectric ceramic/ferrite composites

作　　者：陈文媛[1] 丁晓鸿 滕林[1] 杨邦朝[1] 

机构地区：[1]电子科技大学微电子与固体电子学院,四川成都610054 [2]深圳振华富电子有限公司,广东深圳518109

出　　处：《电子元件与材料》2007年第9期4-6,共3页Electronic Components And Materials

摘　　要：将MgTiO3微波介质陶瓷与Ni-Zn-Cu铁氧体进行低温共烧实验,研究了两种材料的低温烧结特性,结果表明,添加适量的Bi2O3能将复合材料的烧结温度降至900～920℃,并且使得烧结更加致密化。实验证明两种材料之间没有发生化学反应,各自保持了原有的物相,二者具有良好的化学相容性。该复合材料既具有铁电性又具有铁磁性,并且能满足低温共烧工艺的要求,有很好的应用前景。The composites were prepared by low temperature co-firing MgTiO3 microwave dielectric ceramic and Ni-Zn-Cu ferrite. The co-firing properties were investigated. It is found that Bi203 can reduce sintering temperature to 900～ 920 ℃ and improve density. The results show that there is no chemical reaction between MgTiO3 microwave dielectric ceramic and Ni-Zn-Cu ferrite and the two still keep their own phase structures.

关 键 词：无机非金属材料 微波介质陶瓷 铁氧体 低温共烧 烧结温度 

分 类 号：TQ174.75[化学工程—陶瓷工业]