基于模态分析对电脑显示器后壳的研究  

Experimental Modal Analysis on Back Cover of Computer

作　　者：骆志高[1] 马超[1] 王海涵[1] 

机构地区：[1]江苏大学机械工程学院,江苏镇江212013

出　　处：《塑料工业》2007年第9期38-40,共3页China Plastics Industry

摘　　要：以显示器后壳为研究对象,利用试验模态分析理论,研究了后壳的刚度;采用锥击法对其进行模态测试,获得了结构的模态频率、阻尼、振型等模态参数,为改进后壳的结构设计提供了试验依据和改进思路。The stiffness of the back cover of computer was studied by means of experimental modal theory. The cover was modal tested by means of hammering mcthod, and the modal frequency, damping and vibration parameters of the structure of the cover were obtained, which provide the improvement of the structural design of the cover with experimental basis and advanced thinking.

关 键 词：模态分析 刚度 阻尼 振型 锤击法 

分 类 号：TQ320.7[化学工程—合成树脂塑料工业]