黑陶瓷封装工艺研究  

A Study on the Packaging Technology of Glass Sealed Package

作　　者：母继荣[1] 李书军[1] 白光显 

机构地区：[1]电子工业部东北微电子研究所,沈阳110032

出　　处：《微处理机》1997年第2期22-24,共3页Microprocessors

摘　　要：通过对黑陶瓷封装工艺的研究，得到了理想的封装工艺条件，并建立了一条稳定性好、成品率高的封装工艺线。同时成功地封装了一些型号的电路，性能优异，通过了高可靠封装质量考核。The packaging technology of glass sealed package was studied in this paper. We obtained ideal packaging conditions and set up a stable processing ling with high yields. Several types of ICs were packaged successfully. The characters of these ICs were excellent and passed the test of high reliable packaging.

关 键 词：黑陶瓷 低熔玻璃 共晶粘结 IC 封装 

分 类 号：TN305.94[电子电信—物理电子学]