低气压下计算机显卡芯片温升特性的试验研究  

Experimental study of temperature rise of computer graphic card at reduced atmospheric pressure

作　　者：赵磊[1] 刘叶弟[1] 臧建彬[1] 程熠[1] 

机构地区：[1]同济大学机械工程学院,上海200092

出　　处：《内燃机车》2007年第10期5-8,共4页Diesel Locomotives

摘　　要：计算机显卡芯片的散热是通过与空气的对流换热来实现的。根据传热学原理,对流换热强度会由于气压的降低而减弱。青藏高原平均大气压力仅65.2kPa,远低于海平面处。这将导致通过自然对流来散热的计算机显卡芯片的散热特性变差,工作温度升高,可能会影响其正常工作。通过试验研究了静音型(无风扇仅带散热片)计算机显卡芯片在大气压力降低时的温升特性。IC chip of a computer graphic card dissipates its heat by convective heat transfer and the convective heat transfer rate will decrease due to the reduced atmospheric pressure by heat transfer theory.The mean atmospheric pressure of 65.2kPa in Qinghai-Tibet plateau is much lower than that at sea level, which will cause the decrease of the heat dissipation,temperature rise,and finally abnormal function of IC chip of a computer graphic card.The temperature rise characteristics of IC chip of quiet type computer graphic card at reduced atmospheric pressure was investigated by experiment.

关 键 词：低气压 显卡芯片 温升特性 试验 

分 类 号：TB942[一般工业技术—计量学] TN492[机械工程—测试计量技术及仪器]