牙本质粘接界面微渗漏的观察方法比较  

Comparison of Methods for Observing the Leakage in the Dentin Bonding Interface

作　　者：赵信义[1] 何惠明[1] 李石保[1] 刘芳[1] 

机构地区：[1]第四军医大学口腔医学院修复科,陕西西安710032

出　　处：《口腔医学研究》2007年第5期488-491,共4页Journal of Oral Science Research

基　　金：国家自然科学基金基金资助项目(编号:30470433)

摘　　要：目的:比较光镜及扫描电镜观察牙本质粘接界面微渗漏的能力。方法:去除磨牙面釉质,暴露牙本质,分别用2种粘接剂(Prime&Bond NT、Clearfil S3Bond)粘接牙本质,其上制作复合树脂冠。顺牙齿长轴,在相互垂直的两个方向片切牙齿,制备条状试样,将试样相继浸泡于氨化硝酸银溶液及显影液中,然后测定微拉伸粘接强度。最后在光镜及扫描电镜下观察混合破坏试样的断面。结果:光镜下可观察到断面残留粘接剂下面的银渗漏,而扫描电镜下却看不到这些银渗漏;扫描电镜二次电子图像可清晰显示断面的形貌,背散射电子图像清晰区别银渗漏与其它结构。结论:将光镜和扫描电镜观察相结合,可更全面地了解牙本质粘接断面的微渗漏。Objective：To compare the capacity of light microscope and scanning electron microscope（SEM）to observe the leakage in the dentin interface.Methods：The occlusal enamel of human third molar was cut out and the dentin exposed,followed by the application of dental adhesive（Prime＆Bond NT、Clearfil S3 Bond）,then a composite resin crown was built up.After storage in water（37℃）for 24 h,all teeth were vertically serially sectioned into matchstick-shaped specimens through the bond interfaces.All specimens were then immersed in ammoniacal silver nitrate solution,followed by developing solution.At last all specimens were subjected to microtensile test at a cross-head speed of 1mm/min and their fracture surface were observed under light microscope and SEM.Results：The silver leakage beneath adhesive residual covered on the fracture surface can be observed under light microscope,which cannot be observed under SEM either in secondary electron image or backscattering electron image.The backscattering electron image presented clear difference between surface silver leakage and other structure.Conclusion：A combination of light microscope and SEM can demonstrate the leakage in the interface more clearly and more completely.

关 键 词：粘接界面 微渗漏 形态 粘接剂 断面分析 

分 类 号：R783.3[医药卫生—口腔医学]