跌落碰撞下SMT焊点可靠性研究进展  

PROGRESS IN RESEARCH OF SMT SOLDER JOINT RELIABILITY DURING DROP IMPACT

作　　者：刘芳[1] 孟光[1] 赵玫[1] 

机构地区：[1]上海交通大学机械系统与振动国家重点实验室,上海200240

出　　处：《振动与冲击》2007年第10期92-95,共4页Journal of Vibration and Shock

基　　金：国家杰出青年科学基金项目(10325209)

摘　　要：针对在跌落碰撞条件下便携式电子产品中SMT连接焊点的可靠性问题,对该领域相关的理论和实验研究成果进行了综述。介绍了跌落碰撞环境下SMT焊点在跌落试验、数值模拟、寿命预测模型以及无铅焊点的可靠性研究的现状和进展,并对跌落碰撞下SMT焊点的可靠性研究进行了展望。SMT solder joint reliability issues caused by drop impact are received more and more attention in recent years. Research results of theories and experiments in this field are summarized. Current research status and progress in drop test, numerical simulation, life prediction model and reliability of lead-free solder joint are introduced. With deve-lopment of electronic packaging technology, lead-free in electronic packaging and the challenge of solder joint reliability are discussed.

关 键 词：SMT 跌落 焊点可靠性 数值模拟 无铅 

分 类 号：O347.3[理学—固体力学] TN406[理学—力学]