大功率LED散热封装技术研究的新进展  

New Development of Technical Research on Heat-Release Package of High-Power LEDs

作　　者：苏达[1] 王德苗[1] 

机构地区：[1]浙江大学,浙江杭州310027

出　　处：《电力电子技术》2007年第10期13-15,共3页Power Electronics

摘　　要：如何提高大功率发光二极管(Light Emitting Diode,简称LED)的散热能力,是LED器件封装和器件应用设计要解决的核心问题。详细分析了国内外大功率LED散热封装技术的研究现状;总结了其发展趋势,并指出了减少内部热沉可能是今后的发展方向。How to improve the heat-sinking capability is one of the key technical problems for the package and application design of device concerned with high-power LEDs.The present technical research on heat-release package of highpower LEDs is analyzed,and the trend is summarized.Besides,it suggests that reducing the internal heat sink may be one of the developments in the future.

关 键 词：电力半导体器件 发光二极管 光电元件 散热 封装 

分 类 号：TN312[电子电信—物理电子学]