氮气保护对无铅再流焊焊点外观质量的影响  

Nitrogen Protection's Effect on Solder Joint Appearance in Lead-free Reflow Soldering

作　　者：史建卫 梁永君 王洪平 

机构地区：[1]日东电子科技(深圳)有限公司,广东深圳518103

出　　处：《电子工业专用设备》2007年第10期44-49,共6页Equipment for Electronic Products Manufacturing

摘　　要：由于无铅钎料润湿性较差,在实际生产中普遍采用氮气保护。通过新制定的氮气保护无铅再流焊工艺,对焊点外观质量进行了统计分析。其结果显示氮气保护可以减少元件偏移和桥连等缺陷,对竖碑、焊球和锡珠等缺陷也有一定影响。Nitrogen Protection is used in practical industry because of poor wettability of lead-free solder. This work does the process of lead-free reflow soldering under N2 protection, and the solder joint quality has been analyzed statistically. From this report, it has been known that using N2 Protection can decrease the defects of component displacement and solder bridging, also have an effect on other defects such as tombstone, solder ball and solder bearing, and so on.

关 键 词：氮气保护 无铅再流焊 焊点质量 元件偏移 空洞 

分 类 号：TG425[金属学及工艺—焊接]