热超声倒装键合机视觉系统的设计与实现  

Design and realization of machine vision system in thermosonic flip-chip bonder

作　　者：李建平[1] 邹中升[1] 王福亮[1] 

机构地区：[1]中南大学机电工程学院,湖南长沙410083

出　　处：《中南大学学报（自然科学版）》2007年第1期116-121,共6页Journal of Central South University:Science and Technology

基　　金：国家自然科学基金资助项目(50390064);国家"973"计划项目(2003CB716202);国家教育部留学回国人员基金资助项(76084)

摘　　要：针对热超声倒装键合过程中对准工作的特点,确定合理的视觉自动对准方案,在对多种颜色和形状的LED光源进行实验对比的基础上,设计环形LED光源与单个LED发光二极管组合的照明方式,使芯片、基板表面亮度一致且表面几何特征清晰。视觉软件以HexSight为核心,利用创建参考点实现不同目标的识别,并对2个CCD摄像机的控制方案进行优化。通过分析多次识别结果对单项误差进行评估,并以实验用1 mm×1 mm的表面有8个凸点的芯片为例计算视觉识别系统的综合误差,结果表明此视觉识别系统满足芯片键合时对定位精度的要求。According to the fact that accurate alignment is very crucial in the process of chip package, the structure of vision alignment system in automatic thermosonic flip-chip bonder was presented. Based on experiments on various color and style LED lights, the single-color LED illumination composed of a ring LED light and some LED lamps was adopted to get uniform luminance within visual field. The vision software was developed based on HexSight, the method of recognition of different objects（chip ＆ substrate）, control of two CCD cameras and key points of creating model for chip and substrate were presented. According to the recognition error of translation by experiments on scale 1 mm×1mm chips, the composite position error of the vision system was calculated, and the result demonstrates that the precision of this vision alignment system satisfies the bonding process of scale 1 mm×1 mm chips with 8 bumps.

关 键 词：热超声倒装键合 机器视觉 HexSight视觉软件 误差分析 

分 类 号：TP242.62[自动化与计算机技术—检测技术与自动化装置] TP271.4[自动化与计算机技术—控制科学与工程]