免清洗型软钎膏用锡基合金焊粉  

Tin Based Alloy Solder Powder for Free Cleaning Type Soldering Paste

作　　者：徐柱天[1] 张少明[1] 李永伟[1] 李可平[1] 朱学新[1] 

机构地区：[1]北京有色金属研究总院

出　　处：《粉末冶金技术》1997年第2期130-134,共5页Powder Metallurgy Technology

摘　　要：采用气体雾化法研制了ＳＭＴ用免清洗型软钎膏的锡基合金焊粉，其合金成分及杂质元素含量达到美国ＱＱ－Ｓ－５７１Ｅ和日本ＪＩＳ－Ｚ－３２８２Ａ级标准，氧化物含量达到美国Ｍｕｌｔｉｃｏｒｅ公司无氧焊粉的标准，一次出粉率平均达到７０％以上。Gas atomizing process has been used for developing SMT purposed raw material tin based alloy soldering powder of free cleaning type soldering paste,the alloy composition and impurity component contents of which have reached US QQ SS 571E and JAP JIS Z 3282A grade standards with oxide contents meeting the standard of US Multicore Co.'s oxygen free flux powder and with an average single powder production rate over 70%. \

关 键 词：气体雾化法 锡基合金 焊粉 焊膏 

分 类 号：TG425.1[金属学及工艺—焊接]