硅营养抑制钠盐及铜盐毒害水稻秧苗的研究  

A Study on Poisoning Rice (Oryza sativa L.) Seedling with Na and Cu Salts Through Inhibition of Si Nutrition

作　　者：王永锐[1] 成艺[1] 胡智群 周建华[1] 张以顺[1] 

机构地区：[1]中山大学生命科学学院

出　　处：《中山大学学报（自然科学版）》1997年第3期72-75,共4页Acta Scientiarum Naturalium Universitatis Sunyatseni

摘　　要：营养液培养水稻ＯｒｙｚａｓａｔｉｖａＬ．秧苗２周后发现［ＮａＣｌ］超过０．１０３ｍｏｌ／Ｌ和［Ｃｕ－ＳＯ４］超过０．０９４ｍｍｏｌ／Ｌ时，秧苗地上部和根受毒害、致死．［ＣｕＳＯ４］达０．０３１ｍｍｏｌ／Ｌ时亦使根受伤害严重．加入硅酸盐使［ＳｉＯ２］达到１３．０４ｍｍｏｌ／Ｌ有抑制毒害作用，苗地上部鲜重增重率及根／苗干重比率高，而非毒害钠盐。The rice shoot and rice root were poisoned and all or somewhat died when the concentration of NaCl and CuSO 4 is more than 0.103 mol/L and 0.094 mmol/L in Yoshida’s nutrition solution after 2 weeks of culturing. In particular, the CuSO 4 concentration more than 0.031 mmol/L seriously inhibited and poisoned the rice root. After adding sodium silicate to increase SiO 2 concentration to 13.040 mmol/L in the nutrition solution and cultured rice seedling, the rice shoot and rice root were lightly poisoned and fresh weight of rice shoot and the dry weight ratio of root/shoot increased. But the seedling weight and the dry matter ratio of root/shoot increased in the nutrition solutions of non poisonous concentrations of Na and Cu salts when Si was not added.

关 键 词：硅 水稻 幼苗 毒害 钠盐 铜盐 

分 类 号：X503.231[环境科学与工程—环境工程]