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作 者:刘征[1] 王洪军[1] 陈新辉[1] 蔡安富[1] 崔颖[1] 张殿祥[1] 高陇桥[1]
出 处:《真空电子技术》2007年第3期52-55,共4页Vacuum Electronics
摘 要:以生产应用为目的,通过对工艺-结构-性能相互关联的研究,开发出适用于热压铸陶瓷和等静压陶瓷的M系列金属化配方和工艺;以及具有自主知识产权的N系列环保型烧结镍工艺技术,并在大批量生产中成功应用。Aiming to the mass production application, an effective metallizing method, including metallizing formulation of M-series and their metallizing process, were developed by investigating the co-relationship among the metallizing process, the structure of the metallizing layer and the properties of the metallizing layer. The method is especially applicable to the metallization of hot-injected ceramics and isostaticpressed ceramics. At the same time, a Ni coating and its sintering technology on the surface of the metallizing layer were developed, which is environment friendly, and the intellectual properties of the technology is authorized by ourselves. The technology has been applied in the mass production successfully, and a remarkable economic and social benefit was achieved.
分 类 号:TB756[一般工业技术—真空技术]
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