矩形片式电阻元件的半导体激光软钎焊技术  

Diode laser soldering for chip resistor component

作　　者：韩宗杰[1] 薛松柏[1] 张昕[1] 王俭辛[1] 费小建[1] 禹胜林[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,南京210016

出　　处：《焊接学报》2007年第11期49-52,共4页Transactions of The China Welding Institution

基　　金：江苏省普通高校研究生科研创新计划资助项目(CX07B087z);江苏省"六大人才高峰"资助项目(06-E-020)

摘　　要：采用Sn-Ag-Cu作为钎焊材料,研究了矩形片式电阻元件的半导体激光软钎焊技术,采用微焊点强度测试仪研究了其力学性能。结果表明,当激光钎焊时间固定时,随着激光输出功率的增加,电阻焊点的剪切力呈现增加的趋势,在某一功率左右达到最大值。随着激光钎焊时间的增加,其所对应的最佳激光输出功率逐渐减小,最佳的激光钎焊时间为1s。对比试验结果表明,激光软钎焊的最佳工艺参数组合所得到的片式电阻焊点力学性能优于采用传统红外再流焊工艺所获得的片式电阻焊点的力学性能。Diode soldering experiments of rectangular chip resistor components were carried out using Sn-Ag-Cu lead-free solder, the mechanical properties of the micro-joints were studied by STR-1000 micro-joints tester. The results indicate that as the laser soldering time is fixed, the shear force of chip resistor micro-joints becomes larger with the increase of laser output power, and the shear force is the largest at a optimum power. With the increase of laser soldering time, the optimum power decrease, and 1s is the best laser soldering time. Competitive experiments results show mechanical properties of chip resistor micro-joints soldered with laser soldering system is better than that of chip resistor micro-joints soldered with IR reflow soldering method.

关 键 词：矩形片式电阻 Sn—Ag—Cu无铅钎料 半导体激光软钎焊 焊点力学性能 

分 类 号：TG454[金属学及工艺—焊接] TG456