陶瓷球栅阵列封装热致疲劳寿命分析  

Thermal resulted fatigue life analysis of ceramic ball grid array package

作　　者：邵宝东[1] 孙兆伟[1] 王丽凤[2] 王直欢[1] 

机构地区：[1]哈尔滨工业大学卫星技术研究所,哈尔滨150080 [2]昆明理工大学建筑工程学院工程力学系,云南650093

出　　处：《哈尔滨工业大学学报》2007年第10期1625-1630,共6页Journal of Harbin Institute of Technology

基　　金：国家重点基础研究发展规划资助项目(5131201)

摘　　要：建立改进的整体与局部（global/local）相结合的有限元模型,并用模型对FF1152（1152-Ball Flip-Chip Fine-Pitch BGA）中的复合焊点用有限元软件MARC进行应力应变以及塑性功累积分析,确定了最危险焊点位置;同时根据以上分析结果,采用Darveaux等人提出的塑性能量累积方程,在循环温度0～100℃的加速失效条件下,预测危险焊点的热疲劳寿命,所得结果与国外相关文献数据相一致.首次利用Nastran软件的优化功能和手动拟合相结合的方法确定等效焊点的等效参数,与真实焊点的比较结果显示,等效的结果总体误差为3.01%,表明改进的三维有限元模型是非常准确而有效的分析模型,并可以用来方便地分析不同类型的SMT封装.A full three - dimensional （3 - D） finite element analysis is not possible anymore. In order to deal with the problem, a modified global/local finite element model was established. A finite element software named MARC was used to analyze the thermal strain/stress and accumulated plastic energy of the complex solders in FF1152 （1152 -Ball Flip-Chip Fine-Pitch BGA）. Thus,the location of the most critical solder was identified. Then under the accelerated fatigue condition of 0℃ to 100℃, a plastic energy accumulate based fatigue life prediction model was used to predict the most critical solder＇ s thermal fatigue life. And the result is quite approximate to the foreign data. The optimizing function of Nastran software and manual draft join was used to confirm equivalent parameter of equivalent solder. The results which compare with real solder indicate that the error of equivalent result is 3.01%. Therefore, the validity and correctness of the modified model is demonstrated, and the modified model can be used to analyze different types of SMT encapsulation.

关 键 词：有限元法 热疲劳 CBGA封装 复合焊点 

分 类 号：TN305.94[电子电信—物理电子学]