1-3型压电复合材料电极的制备  

Preparing electrodes on 1-3 piezoelectric composite

作　　者：万媛媛[1] 李莉[1,2] 王丽坤[1] 秦雷[1] 魏兵[1] 

机构地区：[1]北京信息工程学院传感技术研究中心,北京100101 [2]北京邮电大学自动化学院,北京100876

出　　处：《功能材料》2007年第A02期738-740,共3页Journal of Functional Materials

基　　金：国家自然科学基金重点资助项目（60572004）.

摘　　要：采用磁控溅射工艺以Cu、Ag为靶材在1-3型压电复合材料表面制备电极．研究了两种金属材料的溅射镀膜工艺，系统地分析了溅射功率对金属沉积速率、电极导电性能及附着力的影响．结果表明，两种金属的沉积速率随溅射功率的增加呈线性增加，电极方阻及电阻率均随功率增大而减小，溅射功率为100W时电极的附着力较好．The Cu and Ag thin films are deposited on 1-3 PZT/epoxy piezoelectric composites by magnetron sputtering. The sputtering parameters, such as sputtering power, deposition rate, conductibility and contact performance of the film have been investigated. Results of the experiment show that the deposition rate of Cu and Ag film increase almost linearly with increasing sputtering power. At the same time, with increasing sputtering power, both the resistance of per square and the resistivity of film decrease. At sputtering Dower of 100W, the thin film has good contact property.

关 键 词：磁控溅射 电极 导电性能 附着力 

分 类 号：TB43[一般工业技术]