基于中心积分法的11维集成光波导芯片封装系统  

11D integrated optic waveguide chip packaging system based on center-integration algorithm

作　　者：隋国荣[1] 陈抱雪[1] 周建忠[1] 傅长松[1] 矶守[2] 

机构地区：[1]上海理工大学光学与电子信息学院,上海200093 [2]日本东京农工大学应用化学系

出　　处：《光学精密工程》2007年第11期1649-1655,共7页Optics and Precision Engineering

基　　金：国家自然科学基金资助项目(No.60677023);上海市科学技术发展基金资助项目(No.041111040)

摘　　要：研制了基于中心积分法的集成光波导芯片封装系统,该系统在空间11维上实现了光波导器件的位置调节,通过高精度对准和改进后的中心积分法快速准确地实现芯片对准。在单芯光纤-条波导-单芯光纤系统的封装测试实验中,端面耦合损耗的平均值为0.1136 dB,单次耦合损耗的最大值<0.13 dB,标准偏差<0.02 dB,单次耦合时间<2 min。在单芯光纤列阵-1×8波导分支耦合器-8芯光纤列阵的封装生产中,各通道插入损耗均<10.5 dB,均匀性指标<0.4 dB,单次耦合时间<5 min。数据证明,该系统已完全达到商业化标准,具有良好效果和实用性。A 11D integrated optic wavcguide chip packaging system based on center-integration algorithm was designed and fabricated for adjusting the 11D positions of a waveguide in the space. The chip alignment can be realized quickly and precisely by the precision alignment and the improved center-integration algorithm. The packaging test among single-core fiber, channel waveguide and singlecore fiber shows that the average of end-coupling loss is 0. 113 6 dB, the maximum of single coupling loss is less than 0. 13 dB, the standard deviation less than 0. 02 dB, single coupling time less than 2 min and the whole packaging process time less than 5 min. The packaging produce among singlecore fiber array, 1 × 8 splitter coupler and 8-core fiber array shows that insert loss of every channel is less than 10.5 dB,the homogeneity index less than 0.4 dB, the single coupling time less than 5 min and the whole packaging process time less than 7 min. It is validated that the system can reach the commercial standard by the test data, which means that the system has good effect and practicability.

关 键 词：中心积分法 器件封装 光波导芯片 耦合损耗 

分 类 号：TN256[电子电信—物理电子学]