高频介质加热在木材胶合中的应用  

The application of high-frequency heating technology in wood bonding process

作　　者：陈勇平[1] 王金林[1] 李春生[1] 王志同[1] 

机构地区：[1]中国林业科学研究院木材工业研究所,北京100091

出　　处：《木材加工机械》2007年第5期37-41,共5页Wood Processing Machinery

基　　金：十一五"国家支撑专题"家具地板材的功能修饰与仿真技术";引进国际先进林业科学技术创新项目专题"竹;木基重组装饰材料制造与示范。

摘　　要：从高频胶合的原理出发,介绍了高频胶合的特点及高频加热系统,分析了国内外高频胶合的研究现状,探讨高频胶合中存在的问题,最后提出了高频胶合今后的发展方向。In this paper the basic principles and traits of high-frequency bonding and the relevant heating system were briefly described. Meanwhile, the application of high-frequency technology in wood bonding was reviewed, and the existing problems were also pointed out; finally, the development trend of high-frequency bonding was put forward.

关 键 词：高频 加热 木材 胶合 

分 类 号：TS653[轻工技术与工程]