新型高硅铝合金电子封装复合材料的研究进展  

Research Status of Novel High Silicon Aluminum Alloy for Electronic Packaging Material

作　　者：徐高磊[1] 李明茂[1] 

机构地区：[1]江西理工大学,江西赣州341000

出　　处：《铝加工》2007年第6期10-13,共4页Aluminium Fabrication

摘　　要：微电子集成技术的快速发展对封装材料提出了更高的要求。具有低膨胀系数、轻质化、较高导热率的新型A l-S i复合材料受到了广泛的重视。文章详细介绍了高硅铝合金电子封装材料的性能特点、制备方法以及研究现状,指出了高硅铝合金电子封装材料的发展方向。Electronic packaging materials have been requested to meet the rapid development of IC technology. Novel Al - Si composite materials with low CTE, high TC and density were valued. The characteristics, preparation methods and current research situation of high silicon aluminum alloy were detailed, and developing direction of the high silicon aluminum alloy packaging materials was put forward.

关 键 词：AL-SI 合金 复合材料 电子封装 热导率 热膨胀系数 

分 类 号：TB33[一般工业技术—材料科学与工程]