覆铜板用低分子量双端羟基聚苯醚树脂  

α,ω-Bis(2,6-dimethylhydroxyphenyl)-Poly(2,6-dimethyl-1,4-phenylene oxide) Oligomers Used for Copper Clad Laminate

作　　者：代三威[1] 徐庆玉[1] 刘发喜[1] 王洛礼[1] 

机构地区：[1]湖北省化学研究院,武汉430074

出　　处：《绝缘材料》2007年第6期43-46,共4页Insulating Materials

基　　金：湖北省科技攻关重点资助计划(2005AA101B14)

摘　　要：低分子量α,ω-双(2,6-二甲基羟苯基)聚苯醚(PPO-2OH)具有优异的电性能和耐热性能,改性后的热固性聚苯醚树脂是高性能覆铜板的理想基材之一。介绍了低分子量PPO-2OH的合成方法和热固化改性研究过程,概述了近几年低分子量PPO-2OH针对覆铜板应用的研究进展。α,ω-bis（2, 6-dimethyl hydroxyphenyl）-poly（2, 6-dimethyl-1, 4-phenylene oxide）oligomers （PPO-2OH） has good electrical property and heat resistance, the modified thermosetting polyphenylene oxide resin can be used as the base materials of high performance copper clad laminate. In this paper, the synthetic method of low molecular weight PPO-2OH and the study process on the thermosetting modification were presented, and the application in copper clad laminate was also described.

关 键 词：双端羟基聚苯醚 覆铜板 共混体系 官能化改性 

分 类 号：TM215[一般工业技术—材料科学与工程] TQ326.53[电气工程—电工理论与新技术]