用电镀方法在贮氢合金粉末表面包覆铜的探索  

Method of plating Cu on surface of hydrogen storage alloy powder

作　　者：熊义辉[1] 沈建荣[1] 林根文[1] 李晓春[1] 张福清 

机构地区：[1]上海大学贮氢材料中心

出　　处：《电源技术》1997年第3期98-100,138,共4页Chinese Journal of Power Sources

摘　　要：设计了一种专用电镀装置：阳极为石墨或不锈钢等制成的不溶性阳极；阴极为贮氢合金粉末和承接部分组成的复合阴极；还有保证阴阳极相对运动的机械传动部分——供液和供料部分。采用特殊的电镀方法对贮氢合金粉末进行包覆Ｃｕ处理：随着阴阳极的相对运动，合金粉末和电镀液一起进入阴阳极之间，电镀液在粉末的间隙中流动，在电场作用下Ｃｕ２＋在粉末的表面放电而沉积，获得均匀镀层。主要工艺参数为：电压６Ｖ～１２Ｖ，电流密度２０Ａ／ｄｍ２～４０Ａ／ｄｍ２，阴阳极相对运动速度２ｍ／ｍｉｎ～４ｍ／ｍｉｎ。此方法易于控制铜的包覆总量，制成的镀铜贮氢合金电极具有较好的充放电循环稳定性和较高的电化学容量。A special electroplate method is used for coating copper on the surface of hydrogen storage alloy powder.A special electroplate device is designed,it is composed of:an undissolved anode which is made from graphite or stainless steel;a cathode comprised of an adapter and hydrogen storage alloy powder being coated;a drive gear and a feeding mechanism.By relatively moving of the anode and cathode,the alloy powder and the liquid electrolyte flow into the reaction region between both the electrodes.In electric field,Cu 2+ discharge and deposit on surface of the powder.The main technological parameters are:voltage,6V～12V;current density,20A/dm 2～40A/dm 2;relative velocity of anode and cathode,2m/min～4m/min.Using this method,total Cu coating weight can be controlled and a homogeneous plating layer can be obtained.The electrode with this Cu plating hydrogen storage alloy has a higher electrochemical capacity as well as a steady cycling performance.

关 键 词：贮氢合金粉末 电镀 MH-NI电池 负极材料 镀铜 

分 类 号：TM911.05[电气工程—电力电子与电力传动] TM241.051[一般工业技术—材料科学与工程]