板级跌落碰撞下无铅焊点的可靠性研究  

Researches of Lead-Free Solder Joint Reliability Under Board-Level Drop Impact

作　　者：刘芳[1] 孟光[1] 赵玫[1] 赵峻峰 

机构地区：[1]上海交通大学机械系统与振动国家重点实验室,上海200240 [2]英特尔技术开发(上海)有限公司,上海200131

出　　处：《电子学报》2007年第11期2083-2086,共4页Acta Electronica Sinica

基　　金：英特尔与高校合作基金;国家杰出青年基金(No.10325209)

摘　　要：文中引入一块不同于JEDEC标准测试板的圆形测试板,探究板级跌落碰撞下无铅焊点的可靠性.首先做模态试验了解测试板的动力学特性,接着做跌落测试,同时测量板的应变和加速度历程.并用ABAQUS软件进行模拟,模拟焊点在跌落碰撞条件下焊点的应力应变等.结果表明有限元模拟得到的应变、板中心的加速度响应和试验吻合,而且用模拟预测的失效焊点的位置与试验一致.失效模式是靠近封装一侧的金属间化合物(IMC)界面的脆性断裂.Different from JEDEC standard test board,a round test board was introduced to do drop test and simulation.Lead-free solder joint reliability under board-level drop impact was investigated.Firstiy,modal test was conducted in order to understand dynamic properties of test board.Secondly,strains and acceleration of test board were measured during drop test,and ABAQUS software was used to do drop simulation and model stresses and strains of solder joints under drop impact.Results show that the model established has close values of acceleration response and strain histories as measured in actual drop test,and the failure mode and critical solder ball location predicted by modeling correlate well with testing.The fracture occurs in intermetallic composite（IMC） on the package side.Failure mode is brittle fracture.

关 键 词：无铅焊点 板级跌落 有限元 金属间化合物 失效 

分 类 号：TN306[电子电信—物理电子学]