Ce对SnAgCu系无铅焊料合金组织和性能的影响  

Effect of cerium on the structure and properties of Sn-Ag-Cu lead-free solder

作　　者：张宇航[1] 卢斌[2] 戴贤斌[1] 罗时中[1] 赵四勇[1] 孙福林[1] 高承仲[1] 

机构地区：[1]广州有色金属研究院焊接材料研究所,广东广州510650 [2]中南大学材料科学与工程学院,湖南长沙410083

出　　处：《材料研究与应用》2007年第4期295-299,共5页Materials Research and Application

摘　　要：以Sn-3.5Ag-0.7Cu焊料为母合金,探讨了微量稀土元素Ce对Sn-Ag-Cu合金的电导率、润湿性以及力学性能的影响.研究表明:添加Ce对焊料的电导率的影响不大,对合金的润湿性和力学性能的影响较大.当w(Ce)=0.05%时,焊料合金的综合性能较好.The influence of rare earth element Ce on the conductivities, wetting and mechanical properties of Sn-3. SAg-0.7Cu solder has been studied. It shows that the doping of Ce has a little effect on the conductivity, but great effect on the wetting and mechanical properties of the Sn-Ag-Cu alloy. The solder has a superior comprehensive performance with the addition of 0.05,% Ce.

关 键 词：无铅焊料 SnAgCu合金 润湿性 稀土元素 表面吸附效应 

分 类 号：TG42[金属学及工艺—焊接]