喷射成形60Si40Al电子封装材料的钎焊性能研究  

Brazing Performance of Spray-deposited 60Si40Al Materials for Electronic Packaging

作　　者：白晓婧[1] 杨滨[1] 王子涵[1] 孙淼[1] 

机构地区：[1]北京科技大学新金属材料国家重点实验室,北京100083

出　　处：《热加工工艺》2007年第23期8-10,共3页Hot Working Technology

基　　金：北京市科委国际合作项目(20061003650);北京市教委产学研合作项目(20051003651);教育部博士学科点专项科研基金资助项目(20050008016)

摘　　要：喷射成形Si-Al(wSi=50%～70%)合金因其低的热膨胀系数、高的热导率和低的密度而成为一类新型的电子封装材料。但研究中发现,Si-Al合金的钎焊性能很差。本文采用在Si-Al合金基体上化学浸锌预处理后再行电镀镍镀层的方法,有效地改善了Si-Al合金的钎焊性能。The spray-deposited Si-Al （50-70 Si, wt%） alloys arc one of the novel electronic packaging materials due to their lower thermal expansion coefficients, high heat conductivity and lower density. The brazing performance of Si-Al alloys was found to be very poor. A new method to prepare Ni coating on the Si-Al alloys was proposed. The wettability and brazing performance of spray-deposited Si-Al alloys with Ni coating on the surface of the alloys were improved effectively.

关 键 词：喷射成形 60Si40Al 电子封装材料 电镀 钎焊 

分 类 号：TG454[金属学及工艺—焊接]