用时域反射仪对先进BGA封装中的封装故障隔离(英文)  

Packaging Failure Isolation with Time-Domain Reflectometry (TDR) for Advanced BGA Packages

作　　者：Palei Win Anthony Y.S. Sun 

机构地区：[1]United Test and Assembly Center, 5 Serangoon North Ave 5, Singapore 554916

出　　处：《电子工业专用设备》2007年第12期13-18,53,共7页Equipment for Electronic Products Manufacturing

摘　　要：集成电路封装技术变得越来越复杂,其制造的故障分析(FA)十分复杂。介绍了用时域反射仪对先进封装中的故障隔离技术,这种尝试是通过比较法进行研究的。通过在球栅阵列倒装-芯片(fcBGA)和低外形细节距球栅阵列堆叠芯片(stacked-dieLFBGA)封装中采用时域反射仪并在分析中卓越的实施证明了这种方法是可行的,其中包括信号质量改善以及范围选择。并使用软件模拟来观测在各种故障模式下的时域反射仪信号,以便以不同的故障模式研究时域反射仪性能。得到的观测结果有助于在封装中用时域反射仪进行故障分析隔离。IC packages become increasingly complex, which make failure analysis （FA） very challenging. This paper presents advanced packaging failure isolation with time-domain reflectometry （TDR）, where the efforts are put on comparative method investigation. Flip-chip ball grid array （fcBGA） and stacked-die low-profile fine-pitch BGA （stacked-die LFBGA） packages are used to demonstrate advanced packaging FA isolation with TDR and good practices in analysis are highlighted, including signature quality improvement and ground selection. The paper also uses software to mimic and observe TDR signature under various failure modes in order to study TDR behavior with different failure modes. The acquired observations are helpful in packaging FA isolation with TDR.

关 键 词：先进封装 故障分析 故障隔离 时域反射仪 球栅阵列倒装-芯片封装 低外形细节距球栅阵列堆叠芯片 

分 类 号：TN305.95[电子电信—物理电子学]