微波功能模块温度阶梯焊工艺技术  

Temperature Stepped Welding Technique for Microwave Function Modules

作　　者：李晓艳[1] 赖复尧[1] 王国华[1] 

机构地区：[1]中国西南电子技术研究所,成都610036

出　　处：《电讯技术》2008年第1期113-116,共4页Telecommunication Engineering

摘　　要：针对微波功能模块的结构和电路功能特点,采用多种具有一定熔点间隔的焊料,对微波功能模块的基板、I/O接头、壳体等进行软钎焊连接,替代螺接、铆接等连接形式,为产品的小型化、耐环境、高可靠提供实用的工艺手段。In consideration of the structure and circuit functional character of microwave function modules, the circuit boards, I/O joints and shells of microwave function modules are connected by adopting the multi - melting point solders which can replace the connection form of bolting and riveting. This technique prorides a practical method for the miniaturization, resistance to environment and high reliability of product.

关 键 词：微波集成电路 温度阶梯焊 焊透率 大面积焊接 

分 类 号：TN405[电子电信—微电子学与固体电子学]