IC探针卡激光微孔加工系统与工艺开发研究  

Research on the UV DPSS Laser Micro Drilling System and Processing for IC Probe Card

作　　者：王又良[1] 潘涌[1] 沈冠群[1] 沈可余 姜兆华[1] 张伟[1] 张宛平 

机构地区：[1]上海市激光技术研究所 [2]上海依然半导体测试卡有限公司,上海201203

出　　处：《应用激光》2007年第6期473-475,共3页Applied Laser

基　　金：上海市科学技术委员会资助项目(项目编号:05DZ22311)

摘　　要：本文简单介绍半导体产业集成电路芯片测试用探针卡,分为以悬臂梁方式的环氧探针(Epoxy ring probe)、垂直探针(Vertical probe card)和微弹簧丝探针(Microspring probe card),以及基于微机电系统的MEMS probe card。采用半导体泵浦紫外固体激光(UV DPSSL 355nm),开发了激光微孔成型精细加工系统,运用新的光学设计思想开发了远心扫描物镜等光学元件,成功研制了紫外激光微加工光学系统,开展IC半导体芯片测试探针卡探针导向片微孔列阵成型工艺和材料特性研究,进一步研制开发了新型旋转打孔的电子光学系统。This paper presents several kinds of IC Wafer testing probe card for Semiconductor Packaging and chip test. There are epoxy ring probe,vertical probe card micro spring probe card,and MEMS probe cardo By using new idea and optical design methods of telecentric Ptheta scan lenses to meet requests of 355nm UV DPSS Laser drilling micro hole array. An experiment of UV DPSS laser drilling of hole array for probe guide sheet and laser drilling process of polymer, ceramics has been developed. Furthermore, a novel electro-optical devices and subsystem to generate focused laser beam at high speed rotation will be developed

关 键 词：激光精细加工 355nm紫外固体激光 远心扫描物镜 微孔列阵 

分 类 号：TN248.1[电子电信—物理电子学] TH-39[机械工程]