纯Ti镀制TiSiN薄膜后与Solidex结合强度的研究  

Bonding Strength of TiN Plated Pure Ti and Solidex

作　　者：尹路 王戈 张琳琳[1] 梁海峰[3] 郭天文[1] 

机构地区：[1]第四军医大学口腔医学院 [2]太原鑫泽医院 [3]西安工业大学薄膜技术与光学检测重点实验室

出　　处：《特种铸造及有色合金》2008年第1期18-20,共3页Special Casting & Nonferrous Alloys

摘　　要：在纯Ti表面磁控溅射镀制不同Si含量的TiSiN膜后,比较与Solidex的结合强度并对界面进行分析。试验采用3组纯Ti试件,一组表面不作处理,另两组应用磁控溅射设备镀制不同Si含量的TiSiN膜后烤塑,采用AGS万能材料试验机测试纯Ti与Solidex的结合强度,并应用电子探针显微分析仪观察分析镀膜层-树脂界面。经方差分析显示,镀膜组结合强度优于未镀膜组,镀膜组中提高Si含量增加了结合强度,镀膜组中形成致密非晶态TiN、SiNx,它填补了金属基底与Solidex烤塑专用树脂可能存在的空隙,有助于阻止金属离子渗出。The bonding strength and interface morphology of pure Ti that is plated TiSiN film with different Si content by the magnetron sputtering method and Solidex were investigated by AGS materials testing machine and EMPA(electron microscope probe analysis).Variance analysis reveals that the bonding strength of TiSiN plated pure Ti and Solidex is superior to that of the pure Ti and the Solidex,furthermore,the bonding strength can be increased with increasing in Si content in TiSiN film.The compact amorphous TiN and SiNx phase can be generated in the film and be filled into the porosity between the metal matrix and Solidex light-cured hard crown and bridge composites,which is helpful for preventing the leakage of metal ion from the film,so the bonding strength is improved.

关 键 词：纯Ti 磁控溅射 镀膜 TiSiN 光固化冠桥树脂 结合强度 

分 类 号：TG174.4[金属学及工艺—金属表面处理]