化学镀铜法制备Mo-Cu复合粉体的研究  

Research on Preparation of Mo-Cu Composite Powders by Electroless Copper Plating

作　　者：王光君[1] 王德志[1] 汪异[1] 吴壮志[1] 

机构地区：[1]中南大学材料科学与工程学院,长沙410083

出　　处：《材料导报》2007年第F11期272-274,277,共4页Materials Reports

基　　金：国家自然科学基金(50301017)

摘　　要：采用化学镀技术对平均粒度为3μm的Mo粉末进行化学镀铜,探讨了镀液组成及工艺条件对Mo粉末化学镀钢的影响,利用X射线衍射、SEM对所得粉末进行了分析。结果表明:以TEA为主络合剂,EDTA为辅助络合剂,并加入2,2′-联吡啶和聚乙二醇作为稳定剂,可以成功地在Mo粉上镀铜,复合粉末铜含量为15%～85%(wt)。化学镀铜过程中pH的最佳值在12～13之间,甲醛浓度的最佳值在22～26mL/L之间。The Mo powders with an average particle size of 3μm are coated with copper by electroless plating. The results are examined by SEM and XRD. The influence of the bath composition and plating conditions on electroless copper plating is studied. The results indicate that with the TEA and EDTA as chief and assistant chalet agents respectively, and the 2,2′-bipyridyl and PEG as stabilizers the Mo powders are coated with copper successfully. At the same time,the content of copper coated on Mo-Cu composite powders can be obtained form the range of 15%-85% （wt）. The optimal values of pH and HCHO are between 12-13 and 22-26mL/L, respectively.

关 键 词：Mo-Cu 化学镀铜 粉体 

分 类 号：TB383[一般工业技术—材料科学与工程] TQ174.758[化学工程—陶瓷工业]