基于Hopfield网络的硅镜异形盲孔超声加工路径规划  

Silicon-reflector abnormity blind holes ultrasonic machining path programming based on Hopfield network

作　　者：张云电[1] 胡皇印[1] 林金钳[1] 余芳[1] 

机构地区：[1]杭州电子科技大学机电工程学院,浙江杭州310018

出　　处：《机电工程》2008年第2期15-17,共3页Journal of Mechanical & Electrical Engineering

基　　金：浙江省自然科学重点基金资助项目(Z105528)

摘　　要：单晶硅材料以其优异的物理性能成为了新型轻质反射镜材料,而且设计人员要求在硅晶体端面形成大量异形盲孔。但是,采用传统加工方法很难保证其完整性、加工效率和质量。针对设计、生产的实际情况,研究了超声加工机理,提出了基于Hopfield网络的硅镜超声加工路径规划方案,并给出了规划路径。研究结果表明,该方案为生产实践提供了理论依据,具有广阔的推广应用前景。Single crystal silicon material has outstanding physical performance and has become new type light reflector material. Designers desire to mechanize abnormal blind holes on the end surface of silicon crystal. However, it is hard to assure the integrality of the silicon crystal as well as the machining efficiency by using traditional machining method, and the quality is poor. According to the practical situation, the ultrasonic machining mechanism was studied, planning method for ultrasonic machining path of silicon-reflector based on Hopfield network was presented, and planning path was given. The research results show that the plan provides the theoretical basis for the performance of the project, and it illustrates a good prospect of application and extension.

关 键 词：超声加工 HOPFIELD网络 路径规划 

分 类 号：TP183[自动化与计算机技术—控制理论与控制工程] TG663[自动化与计算机技术—控制科学与工程]