粉状酚醛树脂胶粘剂的制备与应用技术  

Preparation and application technology of powdered phenol-formaldehyde resin adhesives

作　　者：郑志锋[1] 黄元波[1] 张宏健[1] 

机构地区：[1]西南林学院木质科学与装饰工程学院,云南昆明650224

出　　处：《粘接》2008年第2期5-10,共6页Adhesion

基　　金：昆明西木木材工业研究开发公司横向合作项目

摘　　要：探讨了粉状酚醛树脂胶粘剂的制备和应用。研究结果表明，通过喷雾干燥，P—PF胶的可被溴化物含量、游离甲醛含量、固化时间等性能均比原L-PF胶下降；L—PF胶的黏度对P—PF常规性能有较大影响。通过P—PF直接应用于竹大片刨花板的研究结果表明，P-PF胶的颗粒形态及大小、刨花含水率是影响板材内结合强度的重要因素，相同工艺条件下P-PF胶竹大片刨花板的性能要比L—PF胶好。制造竹大片刨花板较佳工艺条件为：板材密度压缩比1：1．4（密度为0.86g／cm^3），施胶量3．5％，刨花含水率12％，热压温度（165±5）℃，闭合速度12．5mm／s，热压时间1．35～1．45min／mm，热压压力8．75MPa。按此工艺制备的板材性能达到或超过加拿大CAN3-O437．0-M85相关要求。The preparation and application technology of the powdered phenol-formaldehyde resin adhesives （ P- PF resins） were explored. The results showed that the brominable substance content, the free formaldehyde content, the free phenol content and the gelation time of P-PF resins obtained by spray drying were lower than that of the corresponding liquid phenol-formaldehyde resin adhesives （ L-PF resins）. The viscosity of L-PF resins had a clear effect on the normal properties of P-PF resins. The results from the direct application of P-PF resins to bamboo-based waferboard showed that the shape and size of the particle of P-PF resins and the moisture content of the wafer had vital effects on internal bonding strength （IB） of the board. The properties of board bonded with P-PF resins were better than those of board bonded with L-PF resins under the same condition. The optimum process parameters of manufacturing the bamboo-based waferboard were as follows ： mat compression ratio of 1 ： 1.4 （ board density 0.86 g/cm^3 ） , sizing amount of 3.5% , wafer moisture content of 12% , hot pressing at （ 165 ±5） ℃ and under 8.75 MPa, closing speed of 2.5 mm/s and pressing time of 1.35 - 1.45 min/mm. Waferboard made under the above conditions had excellent properties equal or even superior to the requirements of Canadian Standard CAN 3-O437.0-M85.

关 键 词：粉状酚醛树脂胶粘剂(P—PF) 喷雾干燥 竹大片刨花板 

分 类 号：TQ433.431[化学工程] S795[农业科学—林木遗传育种]