丁二酰亚胺脉冲无氰镀银工艺研究  

Pulsed Deposition of Silver from Saccinimide Electrolyte

作　　者：张庆[1] 成旦红[2] 郭国才[3] 郭长春[1] 胡佩瑜[1] 

机构地区：[1]上海大学环境与化学工程学院,上海200072 [2]中国浦东干部学院,上海201204 [3]上海应用技术学院,上海200235

出　　处：《材料保护》2008年第2期26-28,共3页Materials Protection

摘　　要：以镀层表面形貌、结合力、抗变色性能和显微硬度为考核指标,采用正交试验法优选了丁二酰亚胺无氰脉冲镀银工艺参数,并与直流条件下的镀银层作了比较。结果表明,脉冲电镀所得镀层表面存在较多微型凹孔,其显微硬度及抗变色性能优于直流镀银层,晶体直径也小于直流镀层;脉冲电流区间略小于直流电镀,镀液分散性稍好于直流电镀。Orthogonal tests were carried out to optimize the parameters for cyanide-free pulsed silver plating,by taking into account the pulse current,surface appearance,adhesion strengdi,tarnishing resistance,and microhardness of the coating,and a comparison was made between direct current silver electroplating and pulsed silver electroplating.It was found that the pulsed electroplated silver coating had micro-pits on the surface and showed higher hardness and better anti-tarnishing capability than the direct current electroplated silver coating.At the same time,the pulsed electroplated silver coating had smaller grain size than,the direct current electroplated silver coating as well.The Hull cell test results indicated that the pulsed current range was a little bit narrower than that of direct current electroplating,while the dispersive capability of the pulsed plating bath was slightly better than that of the direct current silver electroplating bath.

关 键 词：无氰镀银 脉冲 丁二酰亚胺 正交试验 镀层性能 

分 类 号：TQ153.16[化学工程—电化学工业]