ITO玻璃电致化学发光微流控芯片的低温键合  

Low-Temperature Bonding for Electrochemiluminescence Chemiluminescence Microfluidic Chip with ITO Glass

作　　者：祁娜[1] 罗怡[2] 杨帆[1] 

机构地区：[1]大连理工大学精密与特种加工教育部重点实验室,大连116023 [2]大连理工大学辽宁省微纳米技术及系统重点实验室,大连116023

出　　处：《纳米技术与精密工程》2007年第4期331-334,共4页Nanotechnology and Precision Engineering

基　　金：辽宁省博士启动基金资助项目(20041073)

摘　　要：研究了一种利用商品化的氧化铟锡ITO）玻璃制作一次性电致化学发光微流控芯片的方法．采用光刻和湿法腐蚀ITO（氧化铟锡）层制作微电极；利用同样的方法，在另一片Cr板玻璃上湿法腐蚀微沟道．在玻璃之间夹入PE薄膜作为间质实现芯片的低温键合，采用开孔和预压处理PE薄膜，解决了键合气泡和储液池边缘变形问题．该方法解决了ITO玻璃不耐高温的问题，在120～125℃实现了微通道的有效封接，芯片的键合强度达到0．7MPa．In the paper, a kind of electrochemiluminescence chemiluminescence microfluidic chip made of indium tin oxide （ITO） glass was developed. The ITO films on glass substrates were photolithography and wet etched to get microelectrodes. The microchannels were etched in the same way.on another glass substrate covered by Cr and positive photoresist. Low-temperature bonding process of glass-to-glass was achieved with the assistance of a PE film between the two glass substrates. Using punch reservoir hole and pre-embossing method, deformation of PE film at reservoir edge can be improved. Since high temperature bonding can affect the properties of ITO glass, film assistant bonding technique can be realized under the temperature of 120-125 ℃, and leads to efficient bond and enough bond strength（0.7 MPa）.

关 键 词：电致化学发光微流控芯片 氧化铟锡(ITO)玻璃 低温键合 

分 类 号：TN405[电子电信—微电子学与固体电子学]