甲基磺酸盐在锡及锡基合金镀层中的应用现状  

Application status of methylsulfonate in tin and tin-based alloy plating

作　　者：王亚雄 黄迎红 

机构地区：[1]个旧市冶金研究所,云南个旧661000 [2]云南锡业集团有限责任公司,云南个旧661000

出　　处：《电镀与涂饰》2008年第2期26-29,共4页Electroplating & Finishing

摘　　要：介绍了甲基磺酸(MSA)盐镀液体系的特点。分析了电镀锡及可焊性锡合金镀液的主要成分及特点,介绍了MSA体系在电镀锡钢板中的应用。对比了电镀无铅镀层和Sn–Pb合金镀层的性能,给出了电镀及化学镀锡及锡基合金的工艺配方及操作条件。The characteristics of methylsulfonate （MSA） plating bath were introduced. The main composition of the plating bath of tin and solderable tin alloy was analyzed, and the application of MSA to tin-plated steel sheet was introduced. The performances of lead-free plating and Sn-Pb alloy plating were contrasted, and the process formulation and operation condition of tin and tin based alloy plating and electroless plating were presented.

关 键 词：甲基磺酸盐 锡基合金 可焊性镀层 

分 类 号：TG178[金属学及工艺—金属表面处理]