热输入及掺Ni对Sn-Ag钎料强度的影响  

Effect of thermal input and Ni doping on strength in Sn-Ag solder

作　　者：聂京凯[1] 张冰冰[1] 郭福[1] 夏志东[1] 雷永平[1] 

机构地区：[1]北京工业大学材料科学与工程学院,北京100022

出　　处：《电子元件与材料》2008年第1期29-31,共3页Electronic Components And Materials

基　　金：北京市科技新星计划资助项目(2004B03);教育部新世纪优秀人才支持计划资助项目

摘　　要：Sn-Ag共晶钎料中添加Ni颗粒,在钎料内部形成强化相,达到强化效果。研究了Ni颗粒的添加配比对强化效果的影响,并提出了热输入概念,通过调节热输入量控制钎料的强度。结果表明,φ(Ni)为5%是最佳配比,当热输入量为5.07时,其强度值最高,达60.71 MPa。比未添加Ni的钎料提高50%以上。The main way to improve the shearing property of the eutectic lead-free solder is fixing the reinforced particles as the reinforced phase in to the eutectic solder, 5% in volume rate of the Ni particle was the best proportion in the solder. The concept thermal input was defined. The sheafing strength was controlled by changing the amount of thermal input. Results show the best amount of thermal input is 5.07, the shearing strength of the solder at this thermal input is 60.71 MPa, which is higher 50% than that of without Ni.

关 键 词：金属材料 复合钎料 剪切强度 增强颗粒 热输入 

分 类 号：TG454[金属学及工艺—焊接]